Back to NGA WebinarsRecorded Webinar: “Advancements in Crystallizer Technology – A Critical Step in Enabling ZLD”
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- Amanda Tharp, FTD
Session 6 focuses on brine management and emerging approaches to reducing reliance on thermal crystallizers. The discussion explores brine pre-concentration, efficiency improvements, and lessons from adjacent industries that can help advance semiconductor water circularity. - Lior Eshed, FTD Solutions
NGA is presented as a technology bridge designed to accelerate validation and deployment of advanced water technologies. Lior outlines how NGA identifies industry gaps, validates promising solutions, and helps shorten adoption timelines for brine minimization and ZLD technologies. - Dr. Samantha McBride, University of Pennsylvania
Advanced surface engineering could reshape crystallization and fouling control in semiconductor wastewater systems. Samantha shares research on anti-scaling and controlled nucleation surfaces that reduce crystal adhesion, enable selective precipitation, and support new approaches to non-traditional crystallization. - Dr. Eric Hoek, UCLA & Lawrence Berkeley National Laboratory
Ultra-high-pressure RO and osmotically assisted membrane systems are emerging as key pathways to reduce dependence on thermal brine concentration. Eric explains how next-generation membrane systems may significantly reduce crystallizer size, energy demand, and overall ZLD cost. - Dr. Mike Mickley, Mickley & Associates
Traditional thermal crystallizers remain the industry standard but face major challenges around cost, energy use, and operational complexity. Mike reviews a range of emerging alternatives—including direct-contact systems, eutectic freeze crystallization, membrane distillation, and adsorption-based technologies—that could improve future ZLD processing. - Greg Mandigo, Aquatech
True semiconductor ZLD optimization requires evaluating the full treatment system, not just replacing thermal crystallizers. Greg explains why crystallizers remain highly reliable in risk-sensitive semiconductor operations and emphasizes that future innovation must balance cost, scalability, deployment speed, and uptime reliability. - Q&A
The Q&A focuses on which non-thermal technologies are closest to commercialization and what barriers remain for semiconductor deployment. Panelists emphasize that scalability, validation, and operational reliability remain the key factors for broader adoption.